Including a MEMS microphone with integrated pressure sensor and manufacturing method thereof, a first substrate, a first adhesive layer sensitive film, thin film inductive microphone unit with capacitive pressure sensing unit and the first surface of the substrate; a second substrate having a conductor between the dielectric layer and interconnect layer located between the conductors and the dielectric layer in the / second or second of the surface of the substrate adhesive layer; the second substrate and the first substrate is set by the first bonding layer and the adhesive layer second is fixedly connected with the first adhesive layer and the second adhesive layer corresponding to the pattern and are electrically conductive materials. MEMS microphone and pressure sensor and manufacturing method thereof are provided, through the two substrate capacitive pressure sensing unit and a microphone unit integrated chip integrates various MEMS sensors suitable for mass production, is conducive to compatible and integrated circuit technology, improve the standardization of production process and packaging technology, the device is small letter the signal-to-noise ratio of excellent performance, high anti-interference ability.
【技术实现步骤摘要】
【技术保护点】
１．一种ＭＥＭＳ麦克风与压力集成传感器，其特征在于，包括：第一衬底，具有电容式压力传感单元的感应薄膜、麦克风单元的敏感薄膜和所述第一衬底表面的第一粘合层；第二衬底，具有导体间介质层、位于所述导体间介质层中的导体连线层和／或所述第二衬底表面的第二粘合层；其中，所述第二衬底与第一衬底相对设置，通过第一粘合层和第二粘合层固定连接，所述第一粘合层与第二粘合层的图案对应并且均为导电材料。
【技术特征摘要】
【专利技术属性】
技术研发人员：柳连俊，
申请(专利权)人：迈尔森电子天津有限公司，
类型：发明
国别省市：12
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