一种激光器封装结构制造技术

一种激光器封装结构及其导光结构（230），激光器的封装结构包括：基板（210）；激光元件（220），固定在基板的上表面，可发射第一激光光束；导光结构，包括透明导热块和反射镜（232），对激光元件发出的水平方向光进行光整形后变成垂直方向的光出射；波长转换层（240），形成于导光结构的上表面，导光结构作为散热通道，将波长转换层转换过程产生的热导出。激光器的封装结构采用SMD封装，光源器件热导率高，散热性能好，减小热对激光器发光产生的影响，提升封装体的可靠性。

A laser packaging structure

A laser package structure and its light guide structure (230), the package structure of the laser includes: substrate (210); laser element (220), which is fixed on the upper surface of the substrate and can emit the first laser beam; light guide structure, which includes transparent heat conducting block and reflector (232), which can reshape the horizontal light emitted by the laser element into the vertical light; wavelength The conversion layer (240) is formed on the upper surface of the light guide structure, which is used as the heat dissipation channel to export the heat generated in the conversion process of the wavelength conversion layer. The packaging structure of the laser is SMD packaging. The thermal conductivity of the light source device is high and the heat dissipation performance is good. The influence of heat on the laser emission is reduced and the reliability of the packaging body is improved.

【技术实现步骤摘要】
【国外来华专利技术】PCT国内申请，说明书已公开。

【技术保护点】
PCT国内申请，权利要求书已公开。/n

【技术特征摘要】
【国外来华专利技术】PCT国内申请，...

【专利技术属性】
技术研发人员：陈辉，时军朋，李兴龙，廖启维，黄永特，赵志伟，徐宸科，
申请(专利权)人：厦门市三安光电科技有限公司，
类型：发明
国别省市：福建;35